The Au-Si alloys have a melting temperature at 369°C in the eutectic composition, and the color is similar to the high purity. These characteristics can be exploited in the field of jewelry and electronics for used as filler soldering. In this research, are showing results of manufacturing Au-Si alloys with composition 2,2% Si, 2,8% Si and 3,0% Si. The fusion was made in the plasma furnace whit inert argon protection, and the characterization was made by chemical composition using the EDS of Scanning Electronic Microscope (SEM). The microstuctural analysis was made by optical microscope, SEM, DRX, Vickers hardness and microhardness. The melting temperature was evaluates by Diferencial Scanning Calorimetry ( DSC), the color measure was made by CIELab. The microstructure alloys showed dendritics Au phase and the eutectic constituent were silicon acicular precipitates in the gold matrix. The hardness and microhardness values were near 110 HV, and so, the properties were better than high purity gold alloys. The melting temperature were near the 374°C, also showed a color very similar to the high purity gold alloys.
Gold alloys; Au-Si Alloys; High Purity Golden Alloys; Gold Soldering
