We report here on the ability of poly(4-vinylpyridine) (P4VP) films to improve the copper corrosion properties in 0.1 mol L-1 H2SO4. Films formed by Cu(P4VP)2(SCN)2 macromecular-complex were electrochemically or spontaneously (by immersion) grown onto copper surfaces in 3% acetic acid, 0.1 mol L-1 KSCN and P4VP containing solutions. Imaging and electrochemical techniques were employed to characterize the film morphology and evaluate its effect on the copper corrosion, respectively. A substantial increase in corrosion resistance of copper samples spontaneously coated by P4VP films was found in comparison to the uncoated ones. The optimum conditions for spontaneous growth comprise a 3 - 4 h immersion period in a 0.1 mol L-1 P4VP containing solution. Inhibition efficiencies (IE) of 94 - 98% were recorded by employing this methodology. For electrochemically grown P4VP films, the IE was 70 - 85%.
poly(4-vinylpyridine); corrosion; copper
