The bis-[trimethoxysilylpropyl]amine (BTSPA) film filled with copper phthalocyanine (Cu-Ph) was prepared by adding different concentrations of copper phthalocyanine - Cu-Ph and deposited on a carbon steel substrate using 120 ºC and 150 ºC as curing temperatures. For samples cured at 150 ºC a second layer was also deposited. The electrochemical behavior of carbon steel coated with BTSPA filled with Cu-Ph was studied by electrochemical measurements, electrochemical impedance spectroscopy (EIS) and polarization curves, in aerated 0.1 mol L-1 NaCl solution. Physical and chemical characterization was made by thermogravimetric analysis (TGA), scanning electron microscopy, contact angle measurements and infrared spectroscopy. TGA showed no decomposition of Cu-Ph during the curing process. Cu-Ph added into the silane film showed a strong influence on its corrosion resistance, mainly when the samples are cured at 150 ºC. The results showed that lower inhibitor concentrations led to a higher corrosion resistance and the second layer increased by one order of magnitude the corrosion resistance.
corrosion; silane film; BTSPA; inhibitor
