Ti3AlC2
|
45 |
2.3 - 9.4 |
HP |
280 - 600 |
[55 Peng L. Fabrication and properties of Ti3AlC2 particulates reinforced copper composites. Scripta Materialia. 2007;56(9):729-732.] |
C-nanotube |
0,02 |
0 - 2.0 |
CP |
x |
[66 Goudah G, Ahmad F, Mamat O. Microstructural studies of sintered carbon nanotubes reinforced copper matrix composite. Journal of Engineering Science and Technology. 2010;5(3):272-283.] |
Ni coated C |
0.2 - 0.3 |
1.9 |
HP |
x |
[77 Kim C, Lim B, Kim B, Shim U, Oh S, Sung B, et al. Strengthening of copper matrix composites by nickel-coated single-walled carbon nanotube reinforcements. Synthetic Metals. 2009;159(5-6):424-429.] |
SiC |
75 |
5.0 - 20 |
HP |
150 - 97 |
[88 Tjong SC, Lau KC. Tribological behaviour of SiC particle-reinforced copper matrix composites. Materials Letters. 2000;43(5-6):274-280.] |
TiB2
|
3.0 - 5.0 |
15 - 60 |
HP |
150 - 650 |
[99 Yih P, Chung DDL. Titanium diboride copper-matrix composites. Journal of Materials Science. 1997;32(7):1703-1709.] |
Zr2Al3C4
|
25 |
5.0 - 25 |
CP |
180 - 350 |
[1010 Zhang J, He L, Zhou Y. Highly conductive and strengthened copper matrix composite reinforced by Zr2Al3C4 particulates. Scripta Materialia. 2009;60(11):976-979.] |
Diamond |
40 - 50 |
0 - 14 |
HP |
x |
[1111 Guillemet T, Geffroy PM, Heitz JM, Chandra N, Lu Y, Silvain JF. An innovative process to fabricate interphase-free copper/diamond composite films for thermal management applications. Composites Part A: Applied Science and Manufacturing. 2012;43(10):1746-1753.] |
C-nanotube |
0.01 - 0.02 |
0.1 - 0.4 |
HP |
100 - 300 |
[1212 Uddin SM, Mahmud T, Wolf C, Glanz C, Kolaric I, Volkmer C, et al. Effect of size and shape of metal particles to improve hardness and electrical properties of carbon nanotube reinforced copper and copper alloy composites. Composites Science and Technology. 2010;70(16):2253-2257.] |
Al2O3
|
< 0.1 |
1.3 - 3.8 |
CP |
< 40 |
[1313 Shehata F, Fathy A, Abdelhameed M, Moustafa SF. Preparation and properties of Al2O3 nanoparticle reinforced copper matrix composites by in situ processing. Materials & Design. 2009;30(7):2756-2762.] |
C-Fiber |
> 0.2 |
33 |
HP |
150 - 270 |
[1414 Silvain JF, Le Petitcorps Y, Sellier E, Bonniau P, Helm V. Elastic moduli, thermal expansion and microstructure of copper-matrix composite reinforced by continuous graphite fibres. Composites. 1994;25(7):570-574.] |
TiB2
|
- |
0.77 |
Infiltration |
300 - 510 |
[1515 Tu JP, Wang NY, Yang YZ, Qi WX, Liu F, Zhang XB, et al. Preparation and properties of TiB2 nanoparticle reinforced copper matrix composites by in situ processing. Materials Letters. 2002;52(6):448-452.] |
Ti2SnC |
0.5 |
5.0 - 30 |
CP |
164 - 326 |
[1616 Wu JY, Zhou YC, Wang JY. Tribological behavior of Ti2SnC particulate reinforced copper matrix composites. Materials Science and Engineering: A. 2006;422(1-2):266- 271.] |