A microscopical study was undertaken to analyze the eventual fungi adhesion over a polyester imide surface in enameled copper wires. Scanning electron microscopy allowed to observe in these adhered biofilms, a high amount of pigments, hyphae and its enzymatic arsenal probably acting in the surface of the polymer. Due to the highly aromatic nature of this polyester and the residual phenol derivates still present in the reticulated polymer, an antifungal activity could be expected, but no significant changes were noted in fungal growing and in the adhesion process. Additionally, the wires showed completely failure in all insulation properties. The studies aimed to understand and evaluate the great fungi potential that could be explored in biodeterioration and biodegradation processes.
fungi; biofilms; hyphae; pigments; adhesion; scanning electron microscopy; polymeric surface; polyester-imide; enameled copper wires
