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Latin American Journal of Solids and Structures

versão impressa ISSN 1679-7817versão On-line ISSN 1679-7825

Resumo

BRAZ, Bruno de Castro  e  BUSSAMRA, Flávio Luiz de Silva. An Enhanced Random Vibration and Fatigue Model for Printed Circuit Boards. Lat. Am. j. solids struct. [online]. 2017, vol.14, n.13, pp.2402-2422. ISSN 1679-7817.  http://dx.doi.org/10.1590/1679-78253163.

Aerospace vehicles are mostly exposed to random vibration loads during its operational lifetime. These harsh conditions excites vibration responses in the vehicles printed circuit boards, what can cause failure on mission functionality due to fatigue damage of electronic components. A novel analytical model to evaluate the useful life of embedded electronic components (capacitors, chips, oscillators etc.) mounted on Printed Circuit Boards (PCB) is presented. The fatigue damage predictions are calculated by the relative displacement between the PCB and the component, the lead stiffness, as well the natural vibration modes of the PCB and the component itself. Statistical methods are used for fatigue cycle counting. The model is applied to experimental fatigue tests of PCBs available on literature. The analytical results are of the same magnitude order of the experimental findings.

Palavras-chave : Random vibration; fatigue; PCB.

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