Bond Stability of Universal Adhesives Applied To Dentin Using Etch-And-Rinse or Self-Etch Strategies

Cardoso, Gabriela Cardoso de; Nakanishi, Leina; Isolan, Cristina Pereira; Jardim, Patrícia dos Santos; Moraes, Rafael Ratto de

doi:10.1590/0103-6440201902578

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Article • Braz. Dent. J. 30 (5) • Sep-Oct 2019 • https://doi.org/10.1590/0103-6440201902578 copy

Bond Stability of Universal Adhesives Applied To Dentin Using Etch-And-Rinse or Self-Etch Strategies

Authorship SCIMAGO INSTITUTIONS RANKINGS

Abstract

This study evaluated the immediate and 6-month dentin bond strength of universal adhesives used in etch-and-rinse or self-etch bonding strategies. The adhesives tested were Ambar Universal, G-Bond, Single Bond Universal, Tetric N-Bond Universal, and Ybond Universal. Gold standard adhesives (Scotchbond Multipurpose Plus and Clearfil SE Bond) were controls. Microtensile dentin bond strength (n=5 teeth), pH, and C=C conversion (n=3) were evaluated. Data were analyzed at α=0.05. All adhesives showed differences in pH. Ybond had intermediately strong aggressiveness, whereas the others were ultra-mild. The C=C conversion was different in most adhesives. In the etch-and-rinse strategy, all adhesives showed similar results generally except for G-Bond, which had lower bond strength than most adhesives. G-Bond and Tetric-N-Bond showed lower bond strengths after 6 months compared with 24 h, whereas the other adhesives had stable dentin bonds. In the self-etch strategy, G-Bond had lower bond strength than most adhesives. After 6 months, Ambar was the only adhesive showing lower dentin bond strength compared with 24 h. Most adhesives had discreet drops in bond strength during aging when used in the self-etch strategy. The failure modes were also material dependent, with a general pattern of increased adhesive and/or pre-testing failures after storage. In conclusion, the bonding performance of universal adhesives to dentin is material dependent. Most adhesives had stable dentin bonds with results comparable to the gold standard materials, particularly when applied in the self-etch mode. In general, it seems the use of universal adhesives in dentin should not be preceded by phosphoric acid etching.

Key Words:
dental bonding, polymerization, spectroscopy, fourier transform infrared; microscopy, electron

Adhesive	Manufacturer	Batch #	Composition*
Ambar Universal	FGM, Joinville, SC, Brazil	070116	UDMA, HEMA, methacrylate hydrophilic monomers, methacrylate acid monomers, ethanol, water, silanized silicon dioxide, camphorquinone, ethyl 4-dimethylamino-benzoate, surfactant, sodium fluoride
G-Bond	GC, Tokyo, Japan	1309181	Acetone, UDMA, dimethacrylate component, phosphoric acid ester monomer, photoinitiator
Single Bond Universal	3M ESPE, St. Paul, MN, USA	619545	MDP phosphate monomer, dimethacrylate resins, HEMA, polyalkenoic acid copolymer, filler, ethanol, water, initiators, silane
Tetric N-Bond Universal	Ivoclar Vivadent, Schaan, Liechtenstein	U42905	Ethanol, phosphonic acid acrylate, Bis-GMA, HEMA, UDMA, diphenyl (2,4,6- trimethylbenzoyl) phosphine oxide
Ybond Universal	Yller, Pelotas, RS, Brazil	2045	Hydrophilic methacrylate monomers, hydrophobic methacrylate monomers, initiators, stabilizers, silane, ethanol, water, silanized nanoparticles
Clearfil SE Bond	Kuraray, Osaka, Japan	9N0168 9U0270	Primer: MDP, dimethacrylate monomer, HEMA, silica, N,N-diethanol-p-toluidine, CQ; Bond: HEMA, dimethacrylate monomer, Bis-GMA, N,N-diethanol-p-toluidine, silica, camphorquinone
Scotchbond Multipurpose Plus	3M ESPE	N782259 N763504	Primer: Polyalkenoic acid copolymer, HEMA, water, ethanol; Bond: Bis-GMA, HEMA, tertiary amines, photoinitiator

Adhesive	Bonding strategy	Application steps
Ambar Universal	Etch-and-rinse	The dentin was acid-etched with 37% phosphoric acid for 15 s, washed with air/water spray for 15 s, excess dentin moisture water was removed with absorbent paper, a first layer of adhesive was applied and rubbed for 10 s, a second adhesive layer was applied, the solvent was evaporated with air stream for 10 s, the adhesive was photoactivated for 10 s
Ambar Universal	Self-etch	The surface was washed with air/water spray, excess dentin moisture water was removed with absorbent paper, a first layer of adhesive was applied and rubbed for 10 s, then a second adhesive layer was applied, the solvent was evaporated with air stream for 10 s, the adhesive was photoactivated for 10 s
G-Bond	Etch-and-rinse	The dentin was acid-etched with 37% phosphoric acid for 15 s, washed with air/water spray for 15 s, excess dentin moisture water was removed with absorbent paper, the adhesive was actively applied for 10 s followed by solvent evaporation with air stream for 10 s, the adhesive was photoactivated for 20 s
G-Bond	Self-etch	The surface was washed with air/water spray, excess dentin moisture water was removed with absorbent paper, the adhesive was applied and rubbed for 10 s, the solvent was evaporated with air stream for 5 s, the adhesive was photoactivated for 20 s
Single Bond Universal	Etch-and-rinse	The dentin was acid-etched with 37% phosphoric acid for 15 s, washed with air/water spray for 15 s, excess dentin moisture water was removed with absorbent paper, the adhesive was actively applied for 20 s, the solvent was evaporated with air stream for 5 s, the adhesive was photoactivated for 10 s
Single Bond Universal	Self-etch	The surface was washed with air/water spray, excess dentin moisture water was removed with absorbent paper, the adhesive was applied and rubbed for 20 s, the solvent was evaporated with air stream for 5 s, the adhesive was photoactivated for 10 s
Tetric N-Bond Universal	Etch-and-rinse	The dentin was acid-etched with 37% phosphoric acid for 15 s, washed with air/water spray for 15 s, excess dentin moisture water was removed with absorbent paper, the adhesive was actively applied for 20 s, the solvent was evaporated with air stream for 5 s, the adhesive was photoactivated for 10 s
Tetric N-Bond Universal	Self-etch	The surface was washed with air/water spray, excess dentin moisture water was removed with absorbent paper, the adhesive was applied and rubbed for 20 s, the solvent was evaporated with air stream for 5 s, the adhesive was photoactivated for 10 s
Ybond Universal	Etch-and-rinse	The dentin was acid-etched with 37% phosphoric acid for 15 s, washed with air/water spray for 15 s, excess dentin moisture water was removed with absorbent paper, two layers of adhesive were actively applied with rubbing action for 10 s each, the solvent was evaporated with air stream for 5 s after each layer was applied, the adhesive was photoactivated for 20 s
Ybond Universal	Self-etch	The surface was washed with air/water spray, excess dentin moisture water was removed with absorbent paper, two layers of adhesive were applied and each rubbed for 20 s, the solvent was evaporated with air stream for 5 s, the adhesive was photoactivated for 20 s
Scotchbond Multipurpose Plus	Etch-and-rinse	The dentin was acid-etched with 37% phosphoric acid for 15 s, washed with air/water spray for 15 s, the excess dentin moisture water was removed with absorbent paper, the primer was applied and gently air-dried with air stream for 5 s, the adhesive was applied and photoactivated for 10 s
Clearfil SE Bond	Self-etch	The surface was washed with air/water spray, excess dentin moisture water was removed with absorbent paper, the primer was applied and rubbed for 20 s, the solvent was evaporated with air stream for 5 s, the adhesive was applied and photoactivated for 20 s

Adhesive	pH	DC, %
Ambar Universal	2.47 (0.07) c	70.2 (3.7) b
G-Bond	2.55 (0.01) d	88.5 (0.5) a
Single Bond Universal	2.95 (0.05) e	33.7 (2.3) e
Tetric N-Bond Universal	3.52 (0.04) f	50.1 (1.8) d
Ybond Universal	1.40 (0.03) a	55.1 (6.0) cd
Scotchbond Multipurpose Plus	3.95 (0.01) g	61.6 (0.7) c
Clearfil SE Bond	1.83 (0.04) b	68.8 (1.4) b

Bonding strategy	Adhesive system	Storage time in water at 37°C		Average drop
Bonding strategy	Adhesive system	24 h	6 months	Average drop
Etch-and-rinse	Ambar Universal	30.0 (12.1) ^A,ab	28.1 (8.0) ^A,a	6%
	G-Bond	25.8 (5.2) ^A,b	11.8 (6.2) ^B,c	54%
	Single Bond Universal	34.8 (8.7) ^A,a	28.9 (9.7) ^A,a	17%
	Tetric-N-Bond Universal	36.0 (9.3) ^A,a	21.4 (3.1) ^B,b	40%
	Ybond Universal	27.9 (7.4) ^A,ab	31.6 (9.3) ^A,a	-13%
	Scotchbond Multipurpose Plus	34.0 (6.9) ^A,a	27.5 (9.4) ^A,ab	19%
Self-etch	Ambar Universal	40.2 (16.5) ^A,a	25.4 (7.7) ^B,ab	37%
	G-Bond	21.8 (3.0) ^A,b	21.0 (9.8) ^A,b	4%
	Single Bond Universal	31.9 (14.5) ^A,a	27.5 (6.2) ^A,a	14%
	Tetric-N-Bond Universal	34.4 (13.0) ^A,a	32.3 (5.4) ^A,a	6%
	Ybond Universal	23.8 (8.1) ^A,ab	23.1 (3.7) ^A,b	3%
	Clearfil SE Bond	34.4 (13.0) ^A,a	28.1 (10.6) ^A,a	19%

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[1] Correspondence: Prof. Rafael Moraes, Rua Gonçalves Chaves 457, 96015-560 Pelotas, RS, Brasil. Tel: +55-53-3225-6741. e-mail: moraesrr@gmail.com