Aluminum nitride is applied as semiconductor material in optical-electronic devices due to its high thermal conductivity and high heat dissipation. On the other hand, due to high mechanical strength and high-temperature structural stability this material has been studied for thermomechanical application. In this work the results of the physical and mechanical properties of aluminum nitride sintered by hot uniaxial pressing with 5%, 10% and 20% of YAG (Al2O3+Y2O3 ) additions are presented. The specific mass was determined by ASTM C20-87 standard, crystalline phases identified by X-ray diffraction and microstructural analysis performed by scanning electron microscopy. The microhardness and fracture toughness values were determined on the polished surface, at room temperature, using Vickers indentation method. The excellent results obtained for densification and mechanical properties show the viability of the use of aluminum nitride in structural applications.
aluminum nitride; physical properties; mechanical properties
