A new technique was developed to make highly loaded (up to 95%) formaldehyde free natural fiber boards. The purpose of the paper is to report a broad study on 85% kenaf boards using linear thermoplastic polymers as the binder in preparing the boards to determine if these materials have potential in commercial applications by comparing them to other commercial materials. In these materials, linear thermoplastic polymer chains act as an adhesive and the product resembles a typical wood based panel (e.g., phenol formaldehyde fiber board). The process involved the use of small amount of glycerine in the fiber to enhance processibility in a thermo-kinetic mixer followed by hot pressing. In this paper, we report the properties of 85% by weight kenaf fiber boards using polypropylene as the adhesive. A maleated polypropylene was used to improve the adhesion and stress transfer between the adhesive and kenaf fiber. The addition of 2% by weight of glycerine based on the dry weight of kenaf fiber resulted in the best properties of the boards. Differential scanning calorimetric studies suggested that the glycerine had a little effect on the percent crystallinity of the matrix. Dynamic mechanical tests of the 85% boards showed some differences compared to conventional 60% by weight kenaf-PP composites. The 85% kenaf boards had a flexural strength of 75 MPa and a flexural modulus of 6.8 GPa with a specific gravity of 1.24. These properties are comparable to standard formaldehyde free high density hardboards with flexural strengths of 48.3 MPa and flexural modulus of 5.5 GPa, and a specific gravity of 1.28. This paper gives a broad overview of an initial study of these new materials.
wood panel boards; hard boards; wood composites; binderless hardboards; kenaf boards; lignin plasticization
