The objective of this work was to establish the properties of particleboards fabricated with blends of Eucalyptus grandis, low-density polyethylene, high-density polyethylene and polypropylene particles. Two adhesives formulations were used (urea-formaldehyde and urea-formaldehyde plus 0,5% of epoxy adhesive). Panel properties were affected by particle composition. Panels with best properties were fabricated with 75% of wood particles and 25% of high density polypropylene. The addition of epoxy to the urea-formaldehyde adhesive improved of the values of modulus of rupture, hardness and reduced the amount of thickness swelling. Except for the modulus of elasticity, board properties meet grade M-2 ANSI/A1-208/93 requirements.
Panels; thermoplastic resins; wood-plastic composites; adhesives
