Bond strength and marginal microleakage in restorations photopolymerized with LED and halogen light associated with three application modes of a universal adhesive system: in vitro study

RICARDI, Felipe de Brum; BUSATO, Mauro Carlos Agner; BUSATO, Priscilla do Monte Ribeiro; MENDONÇA, Márcio José; ROSA, Saulo Vinicius da; MARCHI, Paulo Guilherme Bittencourt

doi:10.1590/1981-86372019000313586

Brazil

RGO - Revista Gaúcha de Odontologia

Português Español

Brazil

Português Español

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Original • Rev Gaúch. Odontol. 67 • 2019 • https://doi.org/10.1590/1981-86372019000313586 copy

Bond strength and marginal microleakage in restorations photopolymerized with LED and halogen light associated with three application modes of a universal adhesive system: in vitro study

Resistência de união e da microinfiltração marginal em restaurações fotopolimerizadas com LED e luz halógena associadas a três modos de aplicação de um sistema adesivo universal: estudo in vitro

About the authors

ABSTRACT

Objective:

This study aimed to assess the bond strength and marginal microleakage in composite resin restorations, using the Single Bond Universal adhesive system associated with Ultralux (halogen) and Bluephase (LED) light curing units.

Methods:

For bond strength, 80 healthy human third molars were divided into halogen light (n=40) and LED (n=40), and subdivided according to the following application techniques for the adhesive system: etch-and-rinse (enamel), self-etching (enamel), etch-and-rinse (dentin), and self-etching (dentin). The teeth were subjected to the microtensile test and the fracture pattern was observed under an optical microscope at 40X magnification; they were analyzed by ANOVA, and Fisher and Tukey’s tests (5%). For the marginal microleakage test, 120 class II cavities were prepared in 60 healthy human third molars that were randomly divided into halogen light (n=30) and LED (n=30), and subdivided according to the following application techniques for the adhesive system: etch-and-rinse, selective etching, and self-etching. The teeth were thermocycled 2000 times (±5/55°C), stained in 5% basic fuchsin and sectioned for qualitative and quantitative assessments; they were analyzed by Kruskall-Wallis and Dunn tests (5%).

Results:

For the bond strength of enamel and dentin, the adhesive application with prior acid etching was better than self-etching (p<0.0001), regardless of the type of light curing unit (p<0.05). Etch-and-rinse showed the lowest microleakage values (p<0.0001).

Conclusion:

Etch-and-rinse obtained the best results relative to the other application techniques for the adhesive system in both tests, regardless of the type of light curing unit.

Indexing terms
Dentin-bonding agents; Dentistry; Light-curing of dental adhesives

	Etch-and-rinse Halogen (n=10)	Etch-and-rinse LED (n=10)	Self-etch Halogen (n=10)	Self-etch LED (n=10)
Dentin	47.3389 A ± 8.13	47.2387 A ± 7.33	25.5113 B ± 6.81	27.5329 B ± 8.01
Enamel	36.3789 B ± 6.75	45.6544 A ± 7.67	21.2699 C ± 9.45	15.9245 B ± 5.12

	Etch-and-rinse dentin Halogen (n=10)	Etch-and-rinse dentin LED (n=10)	Self-etch dentin Halogen (n=10)	Self-etch dentin LED (n=10)	Etch-and-rinse enamel Halogen (n=10)	Etch-and-rinse enamel LED (n=10)	Self-etch enamel Halogen (n=10)	Self-etch enamel LED (n=10)
Cohesive	41.6 A	41.1 A	25.6 B	22.8 B	28.5 A	29.2 A	18.4 A	10.5 C
Mixed	47.2	44.1	53.8	54.2	45.2	56.2	47.3	44.7
Adhesive	11.1	14.7	20.5	22.8	23.8	14	31.5	39.4
Pre-test failure	0	0	0	0	0	0	2.6	5.2

	Etch-and-rinse Halogen (n=20)		Etch-and-rinse LED (n=20)		Selective etching Halogen (n=20)		Selective etching LED (n=20)		Self-etch Halogen (n=20)		Self-etch LED (n=20)
Median	2	BC	2	B	3	AB	2	BC	3	A	3	AC
Interquartile deviation	0		1		1		0.5		0		1

	Etch-and-rinse Halogen (n=20)		Etch-and-rinse LED (n=20)		Selective etching Halogen (n=20)		Selective etching LED (n=20)		Self-etch Halogen (n=20)		Self-etch LED (n=20)
Arithmetic mean	1.278	BCD	0.923	BD	1.744A	CD	1.693	BCD	3.347	A	2.308	AC
Standard Deviation	±0.68		±0.68		±0.92		±1.19		±1.49		±1.33

	Etch-and-rinse Halogen (n=20)		Etch-and-rinse LED (n=20)		Selective etching Halogen (n=20)		Selective etching LED (n=20)		Self-etch Halogen (n=20)		Self-etch LED (n=20)
Arithmetic mean	1.278	BCD	0.923	BD	1.744A	CD	1.693	BCD	3.347	A	2.308	AC
Standard Deviation	±0.68		±0.68		±0.92		±1.19		±1.49		±1.33

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[1] Note: Different letters indicate statistically significant differences (p<0.05). At least one equal letter indicates statistical similarity (p>0.05).